點擊圖片查看大圖Zytel® HTN52G35HSL BK083
HIGH PERFORMANCE POLYAMIDE RESIN
PA6T/66-GF35
CHARACTERISTICS
Processing
Injection Molding
Special characteristics
Heat stabilized or stable to heat
PRODUCT TEXT
Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability.
Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries.
Zytel® HTN52G35HSL BK083 is a 35% glass reinforced, heat stabilized, lubricated high performance polyamide resin that can be molded in water heated molds. It is also a PPA resin.
PRODUCT INFORMATION
DRY/COND.
TEST NORM
Resin Identification
PA6T/66-GF35
ISO 1043
Part Marking Code
>PA6T/66-GF35<
ISO 11469
Part Marking Code
>PPA-GF35<
SAE J1344
ISO designation
ISO 16396-PA6T/66,GF35,M1CGHR,S10-120
-
RHEOLOGICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Viscosity number
110/*1
cm3/g
ISO 307, 1157, 1628
Molding shrinkage, parallel
0.3/-
%
ISO 294-4, 2577
Molding shrinkage, normal
0.9/-
%
ISO 294-4, 2577
1: formic acid 90%
MECHANICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Tensile Modulus
12000/12000
MPa
ISO 527-1/-2
Stress at break
200/180
MPa
ISO 527-1/-2
Strain at break
2.3/2.6
%
ISO 527-1/-2
Flexural Modulus
10300/10300
MPa
ISO 178
Charpy impact strength, 73°F
45/-
kJ/m2
ISO 179/1eU
Charpy impact strength, -22°F
40/35
kJ/m2
ISO 179/1eU
Charpy notched impact strength, 73°F
9/9
kJ/m2
ISO 179/1eA
Charpy notched impact strength, -22°F
7/6
kJ/m2
ISO 179/1eA
Poisson's ratio
0.33/0.33
-
-
THERMAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Melting temperature, first heat
310/*
°C
ISO 11357-1/-3
Glass transition temperature, 18°F/min
90/45
°C
ISO 11357-1/-2
Temp. of deflection under load, 260 psi
285/*
°C
ISO 75-1/-2
Coeff. of linear therm. expansion, parallel
21/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, normal
67/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Normal, -40-23°C
61/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Normal, 55-160°C
80/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Parallel, -40-23°C
21/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Parallel, 55-160°C
11/*
E-6/K
ISO 11359-1/-2
RTI, electrical, 30mil
150
°C
UL 746B
RTI, electrical, 60mil
150
°C
UL 746B
RTI, electrical, 120mil
150
°C
UL 746B
RTI, impact, 30mil
125
°C
UL 746B
RTI, impact, 60mil
125
°C
UL 746B
RTI, impact, 120mil
125
°C
UL 746B
RTI, strength, 30mil
130
°C
UL 746B
RTI, strength, 60mil
125/*
°C
UL 746B
RTI, strength, 120mil
150
°C
UL 746B
FLAMMABILITY
DRY/COND.
UNIT
TEST NORM
Burning Behav. at 60mil nom. thickn.
HB/*
class
IEC 60695-11-10
Thickness tested
1.5/*
mm
IEC 60695-11-10
UL recognition
yes/*
-
UL 94
Burning Behav. at thickness h
HB/*
class
IEC 60695-11-10
Thickness tested
0.75/*
mm
IEC 60695-11-10
UL recognition
yes/*
-
UL 94
Glow Wire Flammability Index, 30mil
750/-
°C
IEC 60695-2-12
Glow Wire Flammability Index, 60mil
700/-
°C
IEC 60695-2-12
Glow Wire Flammability Index, 120mil
850/-
°C
IEC 60695-2-12
Glow Wire Ignition Temperature, 30mil
775/-
°C
IEC 60695-2-13
Glow Wire Ignition Temperature, 60mil
725/-
°C
IEC 60695-2-13
Glow Wire Ignition Temperature, 120mil
775/-
°C
IEC 60695-2-13
FMVSS Class
B
-
ISO 3795 (FMVSS 302)
Burning rate, Thickness 1 mm
44
mm/min
ISO 3795 (FMVSS 302)
ELECTRICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Volume resistivity
1E13/-
Ohm*m
IEC 62631-3-1
Electric strength
34/33
kV/mm
IEC 60243-1
OTHER PROPERTIES
DRY/COND.
UNIT
TEST NORM
Humidity absorption, 80mil
2/*
%
Sim. to ISO 62
Density
1460/-
kg/m3
ISO 1183
Density of melt
1100
kg/m3
-
Water Absorption, Immersion 24h
0.4/*DS
%
Sim. to ISO 62
DS: Derived from similar grade
INJECTION
DRY/COND.
UNIT
Drying Recommended
yes
Drying Temperature
100
°C
Drying Time, Dehumidified Dryer
6 - 8
h
Processing Moisture Content
≤0.1
%
Melt Temperature Optimum
325
°C
Min. melt temperature
320
°C
Max. melt temperature
330
°C
Min. mold temperature
90
°C
Max. mold temperature
110
°C
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