點擊圖片查看大圖Zytel® HTNFR52G30BL BK337
HIGH PERFORMANCE POLYAMIDE RESIN
PA6T/66-GF30 FR(16+72)
CHARACTERISTICS
Regional availability
- Global
Processing
Injection Molding
Additives
Flame retardant
Special characteristics
Flame retardant
PRODUCT TEXT
Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability.
Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries.
Zytel® HTNFR52G30BL BK337 is a 30% glass reinforced, flame retardant, lubricated high performance polyamide resin that has been developed for connector applications.
PRODUCT INFORMATION
DRY/COND.
TEST NORM
Resin Identification
PA6T/66-GF30FR(16+72)
ISO 1043
Part Marking Code
>PA6T/66-GF30FR(16+72)<
ISO 11469
Part Marking Code
>PPA-GF30FR<
SAE J1344
ISO designation
ISO 16396-PA6T/66,GF30 FR(16+72),M1CF1GR,S10-120
-
RHEOLOGICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Molding shrinkage, parallel
0.3/-
%
ISO 294-4, 2577
Molding shrinkage, normal
0.8/-
%
ISO 294-4, 2577
MECHANICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Tensile Modulus
11800/-
MPa
ISO 527-1/-2
Stress at break
160/-
MPa
ISO 527-1/-2
Strain at break
2/-
%
ISO 527-1/-2
Flexural Modulus
10000/-
MPa
ISO 178
Flexural Strength
240/210
MPa
ISO 178
Charpy impact strength, 73°F
50/35
kJ/m2
ISO 179/1eU
Charpy impact strength, -22°F
40/35
kJ/m2
ISO 179/1eU
Charpy notched impact strength, 73°F
10/-
kJ/m2
ISO 179/1eA
Charpy notched impact strength, -22°F
10/-
kJ/m2
ISO 179/1eA
Poisson's ratio
0.33/-
-
-
THERMAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Melting temperature, first heat
310/*
°C
ISO 11357-1/-3
Temp. of deflection under load, 260 psi
282/*
°C
ISO 75-1/-2
Coeff. of linear therm. expansion, parallel
20/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, normal
63/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Normal, -40-23°C
57/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Normal, 55-160°C
100/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Parallel, -40-23°C
20/*
E-6/K
ISO 11359-1/-2
Coeff. of linear therm. expansion, Parallel, 55-160°C
10/*
E-6/K
ISO 11359-1/-2
RTI, electrical, 60mil
140
°C
UL 746B
RTI, electrical, 120mil
140
°C
UL 746B
RTI, impact, 60mil
120
°C
UL 746B
RTI, impact, 120mil
120
°C
UL 746B
RTI, strength, 60mil
120/*
°C
UL 746B
RTI, strength, 120mil
130
°C
UL 746B
FLAMMABILITY
DRY/COND.
UNIT
TEST NORM
Burning Behav. at 60mil nom. thickn.
V-0/*
class
IEC 60695-11-10
Thickness tested
1.5/*
mm
IEC 60695-11-10
UL recognition
yes/*
-
UL 94
Burning Behav. at thickness h
V-0/*
class
IEC 60695-11-10
Thickness tested
3/*
mm
IEC 60695-11-10
UL recognition
yes/*
-
UL 94
Burning Behav. 5V at thickness h
5VA/*
class
IEC 60695-11-20
Thickness tested
1.5/*
mm
IEC 60695-11-20
UL recognition
yes/*
-
UL 94
Oxygen index
42/*
%
ISO 4589-1/-2
Glow Wire Flammability Index, 30mil
960/-
°C
IEC 60695-2-12
Glow Wire Flammability Index, 60mil
960/-
°C
IEC 60695-2-12
Glow Wire Flammability Index, 120mil
960/-
°C
IEC 60695-2-12
Glow Wire Ignition Temperature, 30mil
925/-
°C
IEC 60695-2-13
Glow Wire Ignition Temperature, 60mil
925/-
°C
IEC 60695-2-13
Glow Wire Ignition Temperature, 120mil
960/-
°C
IEC 60695-2-13
FMVSS Class
DNI
-
ISO 3795 (FMVSS 302)
ELECTRICAL PROPERTIES
DRY/COND.
UNIT
TEST NORM
Relative permittivity, 100Hz
3.5/-
-
IEC 62631-2-1
Relative permittivity, 1MHz
3.3/-
-
IEC 62631-2-1
Dissipation factor, 100Hz
50/-
E-4
IEC 62631-2-1
Dissipation factor, 1MHz
135/-
E-4
IEC 62631-2-1
Volume resistivity
>1E13/-
Ohm*m
IEC 62631-3-1
OTHER PROPERTIES
DRY/COND.
UNIT
TEST NORM
Density
1620/-
kg/m3
ISO 1183
VDA PROPERTIES
DRY/COND.
UNIT
TEST NORM
Emission of organic compounds
35
μgC/g
VDA 277
Odor test
4.5
class
VDA 270
Fogging, F-value (refraction)
95/*
%
ISO 6452
INJECTION
DRY/COND.
UNIT
Drying Recommended
yes
Drying Temperature
100
°C
Drying Time, Dehumidified Dryer
6 - 8
h
Processing Moisture Content
≤0.1
%
Melt Temperature Optimum
325
°C
Min. melt temperature
320
°C
Max. melt temperature
330
°C
Min. mold temperature
90
°C
Max. mold temperature
110
°C
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